Description
Restore clean, high-impact low-frequency performance or center-stage clarity to your audio gear with the STK404-120. Manufactured using Sanyo's proprietary Insulated Metal Substrate Technology (IMST), this genuine-spec thick-film hybrid integrated circuit acts as a high-output 1-channel (mono) Class-AB audio power amplifier, pushing up to 120W maximum into a 6Ω load.
Key Features:
- High-Output Mono Design: Delivers up to 120W (10% THD at 1kHz) or a sustained 80W continuous RMS with under 0.4% distortion, providing maximum dedicated current delivery for high-demand single-channel loads.
- Class-AB Precision: Blends robust power output with low crossover distortion, making it perfect for handling deep bass drops and high-fidelity soundtracks without dynamic clipping.
- Advanced IMST Heat Dissipation: Employs a modern low thermal resistance aluminum substrate to optimize heat distribution across the surface area, preventing the hot spots common in discrete transistor layouts.
- Pre-Designed Circuit Integration: Pin-configured to sync effortlessly with standard manufacturer standby control networks, speaker muting grids, and rapid 0.3-second load-shorting protection arrays.
Technical Specifications:
- Manufacturer: Sanyo / ON Semiconductor
- Package Type: Compact SIP-12 / SIP-ZIP (12-Pin Active Layout with Metal Mounting Base)
- Recommended Operating Voltage: ±41V (Maximum Supply Voltage: ±59V to ±65V)
- Output Load Impedance: Optimized for 6Ω speaker systems
- Primary Applications: Main power block for high-wattage active subwoofers, center-channel stages in surround sound home theater systems, and active instrument amplifiers.
- Condition: Brand New / New Old Stock (NOS).
Critical Installation Notice: Because a mono amplifier module like the STK404-120 concentrates all its thermal energy into a small surface area, exceptional thermal bonding is non-negotiable. Completely clean off all dried original thermal paste from your main aluminum heatsink bracket. Apply a fresh, thin, uniform layer of high-grade silicone thermal compound across the metal backing plate of the module before tightening down the mounting screws.